![]() |
MOQ: | 1 |
Price: | USD23 |
Delivery Period: | 15-20 work days |
Payment Method: | T/T |
Supply Capacity: | 100-1000 |
A temperature sensor is an electronic component that quantitatively measures thermal energy and converts it into a readable signal (voltage, resistance, or digital output) for monitoring and control applications. These devices serve as critical components in systems requiring precise thermal management across industrial, automotive, medical, and consumer sectors.
Technology | Principle | Output Signal | Key Equation |
---|---|---|---|
Thermocouple (T/C) | Seebeck Effect | Voltage (mV) | V = αΔT (α = Seebeck coefficient) |
RTD | Resistive Change | Resistance (Ω) | Rₜ = R₀[1 + α(T-T₀)] |
Thermistor | Non-linear Resistance | Resistance (Ω) | β-parameter equation |
Semiconductor IC | Bandgap Voltage | Digital/Analog | ΔVBE = (kT/q)ln(N) |
Infrared (IR) | Planck's Radiation Law | Voltage (μV) | εσT⁴ (Stefan-Boltzmann) |
Parameter | Thermocouple | RTD (Pt100) | Class A Thermistor | IC Sensor |
---|---|---|---|---|
Range (°C) | -200 to +2300 | -200 to +850 | -50 to +150 | -55 to +150 |
Accuracy | ±1.5°C | ±0.1°C | ±0.05°C | ±0.5°C |
Response Time (τ63%) | 0.1-10s | 1-50s | 0.5-5s | 5-60s |
Long-term Stability | ±0.2°C/yr | ±0.05°C/yr | ±0.02°C/yr | ±0.1°C/yr |
Linearity Error | Non-linear | 0.1% FS | 0.2% FS | 0.5% FS |
Environment | Optimal Sensor | Protection Method |
---|---|---|
High Temp (>1000°C) | Type B T/C (PtRh30-PtRh6) | Ceramic/molybdenum sheath |
Corrosive Media | Hastelloy-sheathed RTD | PFA encapsulation |
Vibration Zones | MEMS accelerometer-compensated | Strain relief fittings |
EMI Fields | Fiber-optic sensor | Dielectric isolation |
Error Budget Analysis
Calculate total system error from:
Sensor inaccuracy
Signal conditioning error
Thermal gradient effects
Dynamic Response Requirements
Compute required time constant:
τ = (mc/hA) for step changes
Thermal Interface Optimization
Thermal paste selection:
Silicone-based (0.5 W/mK)
Metal-filled (5 W/mK)
Feature | Technical Implementation | Protocol |
---|---|---|
Predictive Diagnostics | Embedded degradation algorithms | IEEE 1451.4 |
Wireless Monitoring | Energy-harvesting LoRaWAN nodes | IEC 62591 |
Digital Twin Sync | Real-time thermal modeling | OPC UA |
Automotive: AEC-Q200 Grade 0 (+150°C)
Medical: ISO 80601-2-56 (clinical thermometers)
Aerospace: DO-160G (EMI/RFI immunity)
Food Safety: EHEDG-compliant designs
Calibration Traceability
NIST-traceable procedures per ASTM E2847
3-point minimum verification
Failure Mode Analysis
T/C: Open-circuit detection
RTD: 3-wire vs 4-wire compensation
Lifecycle Testing
Accelerated aging:
1000 thermal cycles (IEC 60751)
High-Vibration: Laser-welded strain relief
Ultra-Fast Response: Thin-film RTDs (τ < 100ms)
Multi-Point Arrays: Distributed fiber-optic sensing
For mission-critical applications, request our Thermal Performance Simulation Report including:
Transient thermal analysis
Signal-to-noise ratio modeling
Failure mode effects analysis (FMEA)
Technical Note: All metal-sheathed sensors require proper grounding to prevent thermoelectric noise in low-level signals. For Class I Div 1 areas, specify intrinsically safe barriers with [Entity Parameters] Vmax, Imax, Ci, Li.
![]() |
MOQ: | 1 |
Price: | USD23 |
Delivery Period: | 15-20 work days |
Payment Method: | T/T |
Supply Capacity: | 100-1000 |
A temperature sensor is an electronic component that quantitatively measures thermal energy and converts it into a readable signal (voltage, resistance, or digital output) for monitoring and control applications. These devices serve as critical components in systems requiring precise thermal management across industrial, automotive, medical, and consumer sectors.
Technology | Principle | Output Signal | Key Equation |
---|---|---|---|
Thermocouple (T/C) | Seebeck Effect | Voltage (mV) | V = αΔT (α = Seebeck coefficient) |
RTD | Resistive Change | Resistance (Ω) | Rₜ = R₀[1 + α(T-T₀)] |
Thermistor | Non-linear Resistance | Resistance (Ω) | β-parameter equation |
Semiconductor IC | Bandgap Voltage | Digital/Analog | ΔVBE = (kT/q)ln(N) |
Infrared (IR) | Planck's Radiation Law | Voltage (μV) | εσT⁴ (Stefan-Boltzmann) |
Parameter | Thermocouple | RTD (Pt100) | Class A Thermistor | IC Sensor |
---|---|---|---|---|
Range (°C) | -200 to +2300 | -200 to +850 | -50 to +150 | -55 to +150 |
Accuracy | ±1.5°C | ±0.1°C | ±0.05°C | ±0.5°C |
Response Time (τ63%) | 0.1-10s | 1-50s | 0.5-5s | 5-60s |
Long-term Stability | ±0.2°C/yr | ±0.05°C/yr | ±0.02°C/yr | ±0.1°C/yr |
Linearity Error | Non-linear | 0.1% FS | 0.2% FS | 0.5% FS |
Environment | Optimal Sensor | Protection Method |
---|---|---|
High Temp (>1000°C) | Type B T/C (PtRh30-PtRh6) | Ceramic/molybdenum sheath |
Corrosive Media | Hastelloy-sheathed RTD | PFA encapsulation |
Vibration Zones | MEMS accelerometer-compensated | Strain relief fittings |
EMI Fields | Fiber-optic sensor | Dielectric isolation |
Error Budget Analysis
Calculate total system error from:
Sensor inaccuracy
Signal conditioning error
Thermal gradient effects
Dynamic Response Requirements
Compute required time constant:
τ = (mc/hA) for step changes
Thermal Interface Optimization
Thermal paste selection:
Silicone-based (0.5 W/mK)
Metal-filled (5 W/mK)
Feature | Technical Implementation | Protocol |
---|---|---|
Predictive Diagnostics | Embedded degradation algorithms | IEEE 1451.4 |
Wireless Monitoring | Energy-harvesting LoRaWAN nodes | IEC 62591 |
Digital Twin Sync | Real-time thermal modeling | OPC UA |
Automotive: AEC-Q200 Grade 0 (+150°C)
Medical: ISO 80601-2-56 (clinical thermometers)
Aerospace: DO-160G (EMI/RFI immunity)
Food Safety: EHEDG-compliant designs
Calibration Traceability
NIST-traceable procedures per ASTM E2847
3-point minimum verification
Failure Mode Analysis
T/C: Open-circuit detection
RTD: 3-wire vs 4-wire compensation
Lifecycle Testing
Accelerated aging:
1000 thermal cycles (IEC 60751)
High-Vibration: Laser-welded strain relief
Ultra-Fast Response: Thin-film RTDs (τ < 100ms)
Multi-Point Arrays: Distributed fiber-optic sensing
For mission-critical applications, request our Thermal Performance Simulation Report including:
Transient thermal analysis
Signal-to-noise ratio modeling
Failure mode effects analysis (FMEA)
Technical Note: All metal-sheathed sensors require proper grounding to prevent thermoelectric noise in low-level signals. For Class I Div 1 areas, specify intrinsically safe barriers with [Entity Parameters] Vmax, Imax, Ci, Li.